10th Generation Intel® Xeon/Core™ Series Processors, High Performance, Expandable and Modular Rugged Embedded Computer


Cincoze DS-1300 High Performance, Highly Expandable

Product Highlights:

  • 10-core 10th-gen Intel® Xeon® and Core™ i9/i7/i5/i3 CPU (max 80 W TDP)
  • 2x GbE LAN and optional 2x 10GbE LAN
  • 2x 2.5″ SATA storage, 3x mSATA sockets, 1x M.2 key M for NVMe SSD
  • 3x full-size Mini PCIe sockets, 2x SIM card slots
  • Optional CMI modules for I/O expansion
  • Optional CFM modules for ignition sensing & PoE
  • Wide operating temperature -40°C to 70°C
  • MIL-STD-810G military standard and EN50155 (EN 50121-3-2 only)

More Powerful & Faster Multiplies Productivity

The DS-1300 series’s 10th-gen CPU brings to 31% better integer multi-tasking for compute-intensive application performance than 9th-gen CPUs*. DDR4 2933 MHz memory further increases speed by 10%**. The processing platform delivers the performance required to consolidate multiple workloads for intelligent devices and applications.

* 31% increase for 10th-gen i9-10900E 65W vs 9th-gen i7-9700 65W CPU
** 10% increase for 2933 MHz of DS-1300 vs 2666 MHz of DS-1200.

Industrial I/O and Modular Expansion

Up to two GbE LAN ports, six USB 3.2 ports, two USB 2.0 ports, two RS232/422/485 ports, two 2.5″ SATA ports, three mSATA ports, one M.2 key M for NVMe SSD, two SIM card slots, three full-size Mini-PCIe slots, and three independent displays (DisplayPort, HDMI, and VGA) are all available in the DS-1300 series. Additionally, it has the ability to be modularly expanded using Cincoze’s CMI/CFM modules to provide more I/O or other features like high-speed 10GbE LAN, PoE, and ignition sensing.

10-Core, Up To 80 W CPU

The workstation-grade 10th-generation Intel® Xeon® or CoreTM i9/i7/i5/i3 CPU with up to 10-core architecture powers the DS-1300 series, which offers greater processing performance. Up to an 80 W TDP Xeon® CPU is supported by the DS-1300. It features DDR4 2933/2666 MHz memory with a maximum capacity of 128 GB, providing unmatched performance in a tough, fanless machine.

Rugged Reliability Against Rigorous Environments

The fanless and cableless industrial design of the DS-1300 series can tolerate demanding conditions. Its distinctive thermal design enables a wide operating temperature range of -40 to 70 degrees Celsius. The MIL-STD-810G military standard and EN50155 (EN 50121-3-2 only) for rolling stock settings are two further strict industry requirements that it has passed.

Cincoze DS-1300 Specifications

Processor Intel® Xeon® Series Processor ( 80W / 35W ):
• Intel® Xeon® W-1270E 8 Cores Up to 4.8 GHz, TDP 80W
• Intel® Xeon® W-1250E 6 Cores Up to 4.7 GHz, TDP 80W
• Intel® Xeon® W-1290TE 10 Cores Up to 4.5 GHz, TDP 35W
• Intel® Xeon® W-1270TE 8 Cores Up to 4.4 GHz, TDP 35W
• Intel® Xeon® W-1250TE 6 Cores Up to 3.8 GHz, TDP 35W
Intel® Core® Series Processor ( 65W / 35W ):
• Intel® Core™ i9-10900E 10 Cores Up to 4.7 GHz, TDP 65W
• Intel® Core™ i7-10700E 8 Cores Up to 4.5 GHz, TDP 65W
• Intel® Core™ i5-10500E 6 Cores Up to 4.2 GHz, TDP 65W
• Intel® Core™ i3-10100E 4 Cores Up to 3.8 GHz, TDP 65W
• Intel® Core™ i9-10900TE 10 Cores Up to 4.5 GHz, TDP 35W
• Intel® Core™ i7-10700TE 8 Cores Up to 4.5 GHz, TDP 35W
• Intel® Core™ i5-10500TE 6 Cores Up to 3.7 GHz, TDP 35W
• Intel® Core™ i3-10100TE 4 Cores Up to 3.6 GHz, TDP 35W
Chipset Intel® W480E Chipset
Graphics Integrated Intel® UHD-630 Graphics
Memory 2x DDR4 2933/2666/2400 SO-DIMM Socket
* Xeon / i9 / i7 Processor Supports Up to 2933MHz
* i5 / i3 Processor Supports Up to 2666 MHz
Supports Un-buffered and Non-ECC Type Up to 64GB
LAN • 2 x GbE LAN, RJ45
- GbE1: Intel® I219
- GbE2: Intel® I210
COM 2 x RS-232/422/485 with Auto Flow Control ( Supports 5V / 12V ), DB9
USB • 2 x 10Gbps USB 3.2 Gen2, Type A
• 4 x 5Gbps USB 3.2 Gen1, Type A
• 2 x 480Mbps USB 2.0, Type A
PS/2 1 x PS/2, 6 Pin Mini-DIN Female Connector
Audio 1 x Line-out, Phone Jack 3.5mm
1 x Mic-in, Phone Jack 3.5mm
Mini PCI Express 3 x Full-size Mini-PCIe Socket
SIM Socket 2 x SIM Socket
CMI (Combined Multiple I/O Interface) • 2 x High Speed CMI Interface for optional CMI Module Expansion
• 2 x Low Speed CMI Interface for optional CMI Module Expansion
CFM (Control Function Module) Interface 1 x CFM IGN Interface for optional CFM-IGN Module Expansion
SSD/HDD • 1x 2.5” Front Accessible SATA HDD/SSD Bay ( SATA 3.0 )
• 1x 2.5” Internal SATA HDD/SSD Bay ( SATA 3.0 )
mSATA 3x mSATA Socket ( SATA 3.0, shared by Mini-PCIe socket )
M.2 SSD 1x M.2 Key M Type 2280 Socket, Support PCIe x4 NVMe SSD or SATA SSD ( SATA 3.0 )
RAID Support RAID 0/1/5/10
Power Supply
Input 9 - 48VDC, 3-pin Terminal Block
Power Budget 180W
Dimensions 227 x 261 x 88 mm
Weight 4.5kg
Mounting Wall Mount
Operating Temperature • 35W TDP Processor: -40°C to 70°C
• 58W – 65W TDP Processor: -40~50°C (With External Fan Kit)
• 80W TDP Processor: -40~40°C (With External Fan Kit)

* PassMark BurnInTest: 100% CPU, 2D/3D Graphics (without thermal throttling)
* With extended temperature peripherals; Ambient with air flow
* According to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14
Storage Temperature -40°C ~ 85°C
Humidity 95%RH @ 70°C (non-Condensing)
Vibration MIL-STD-810G
Shock MIL-STD-810G

Order the DS-1300

A strong Cincoze embedded computer with unmatched performance is the DS-1300. It offers extensive industrial I/O and a wide range of functions. Customization for additional I/O or other functionality to meet diverse applications is made simple with Cincoze’s CMI, CFM, and MEC modular extension. The DS-1300 is approved by industry standards and complies with the demands of industrial settings. For applications involving rolling stock, industrial automation, and factory automation, it provides the best possible performance.

Order DS-1300