Cincoze
DS-1300
10th Generation Intel® Xeon/Core™ Series Processors, High Performance, Expandable and Modular Rugged Embedded Computer
More Powerful & Faster Multiplies Productivity
The DS-1300 series’s 10th-gen CPU brings to 31% better integer multi-tasking for compute-intensive application performance than 9th-gen CPUs*. DDR4 2933 MHz memory further increases speed by 10%**. The processing platform delivers the performance required to consolidate multiple workloads for intelligent devices and applications.
* 31% increase for 10th-gen i9-10900E 65W vs 9th-gen i7-9700 65W CPU
** 10% increase for 2933 MHz of DS-1300 vs 2666 MHz of DS-1200.
Industrial I/O and Modular Expansion
Up to two GbE LAN ports, six USB 3.2 ports, two USB 2.0 ports, two RS232/422/485 ports, two 2.5″ SATA ports, three mSATA ports, one M.2 key M for NVMe SSD, two SIM card slots, three full-size Mini-PCIe slots, and three independent displays (DisplayPort, HDMI, and VGA) are all available in the DS-1300 series. Additionally, it has the ability to be modularly expanded using Cincoze’s CMI/CFM modules to provide more I/O or other features like high-speed 10GbE LAN, PoE, and ignition sensing.
10-Core, Up To 80 W CPU
The workstation-grade 10th-generation Intel® Xeon® or CoreTM i9/i7/i5/i3 CPU with up to 10-core architecture powers the DS-1300 series, which offers greater processing performance. Up to an 80 W TDP Xeon® CPU is supported by the DS-1300. It features DDR4 2933/2666 MHz memory with a maximum capacity of 128 GB, providing unmatched performance in a tough, fanless machine.
Rugged Reliability Against Rigorous Environments
The fanless and cableless industrial design of the DS-1300 series can tolerate demanding conditions. Its distinctive thermal design enables a wide operating temperature range of -40 to 70 degrees Celsius. The MIL-STD-810G military standard and EN50155 (EN 50121-3-2 only) for rolling stock settings are two further strict industry requirements that it has passed.
Cincoze DS-1300 Specifications
| System | |
| Processor | Intel® Xeon® Series Processor ( 80W / 35W ): • Intel® Xeon® W-1270E 8 Cores Up to 4.8 GHz, TDP 80W • Intel® Xeon® W-1250E 6 Cores Up to 4.7 GHz, TDP 80W • Intel® Xeon® W-1290TE 10 Cores Up to 4.5 GHz, TDP 35W • Intel® Xeon® W-1270TE 8 Cores Up to 4.4 GHz, TDP 35W • Intel® Xeon® W-1250TE 6 Cores Up to 3.8 GHz, TDP 35W Intel® Core® Series Processor ( 65W / 35W ): • Intel® Core™ i9-10900E 10 Cores Up to 4.7 GHz, TDP 65W • Intel® Core™ i7-10700E 8 Cores Up to 4.5 GHz, TDP 65W • Intel® Core™ i5-10500E 6 Cores Up to 4.2 GHz, TDP 65W • Intel® Core™ i3-10100E 4 Cores Up to 3.8 GHz, TDP 65W • Intel® Core™ i9-10900TE 10 Cores Up to 4.5 GHz, TDP 35W • Intel® Core™ i7-10700TE 8 Cores Up to 4.5 GHz, TDP 35W • Intel® Core™ i5-10500TE 6 Cores Up to 3.7 GHz, TDP 35W • Intel® Core™ i3-10100TE 4 Cores Up to 3.6 GHz, TDP 35W |
| Chipset | Intel® W480E Chipset |
| Graphics | Integrated Intel® UHD-630 Graphics |
| Memory | 2x DDR4 2933/2666/2400 SO-DIMM Socket * Xeon / i9 / i7 Processor Supports Up to 2933MHz * i5 / i3 Processor Supports Up to 2666 MHz Supports Un-buffered and Non-ECC Type Up to 64GB |
| BIOS | AMI BIOS |
| I/O | |
| LAN | • 2 x GbE LAN, RJ45 - GbE1: Intel® I219 - GbE2: Intel® I210 |
| COM | 2 x RS-232/422/485 with Auto Flow Control ( Supports 5V / 12V ), DB9 |
| USB | • 2 x 10Gbps USB 3.2 Gen2, Type A • 4 x 5Gbps USB 3.2 Gen1, Type A • 2 x 480Mbps USB 2.0, Type A |
| PS/2 | 1 x PS/2, 6 Pin Mini-DIN Female Connector |
| Audio | 1 x Line-out, Phone Jack 3.5mm 1 x Mic-in, Phone Jack 3.5mm |
| Expansion | |
| Mini PCI Express | 3 x Full-size Mini-PCIe Socket |
| SIM Socket | 2 x SIM Socket |
| CMI (Combined Multiple I/O Interface) | • 2 x High Speed CMI Interface for optional CMI Module Expansion • 2 x Low Speed CMI Interface for optional CMI Module Expansion |
| CFM (Control Function Module) Interface | 1 x CFM IGN Interface for optional CFM-IGN Module Expansion |
| Storage | |
| SSD/HDD | • 1x 2.5” Front Accessible SATA HDD/SSD Bay ( SATA 3.0 ) • 1x 2.5” Internal SATA HDD/SSD Bay ( SATA 3.0 ) |
| mSATA | 3x mSATA Socket ( SATA 3.0, shared by Mini-PCIe socket ) |
| M.2 SSD | 1x M.2 Key M Type 2280 Socket, Support PCIe x4 NVMe SSD or SATA SSD ( SATA 3.0 ) |
| RAID | Support RAID 0/1/5/10 |
| Power Supply | |
| Input | 9 - 48VDC, 3-pin Terminal Block |
| Power Budget | 180W |
| Mechanical | |
| Dimensions | 227 x 261 x 88 mm |
| Weight | 4.5kg |
| Mounting | Wall Mount |
| Environmental | |
| Operating Temperature |
• 35W TDP Processor: -40°C to 70°C • 58W – 65W TDP Processor: -40~50°C (With External Fan Kit) • 80W TDP Processor: -40~40°C (With External Fan Kit) * PassMark BurnInTest: 100% CPU, 2D/3D Graphics (without thermal throttling) * With extended temperature peripherals; Ambient with air flow * According to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14 |
| Storage Temperature | -40°C ~ 85°C |
| Humidity | 95%RH @ 70°C (non-Condensing) |
| Vibration | MIL-STD-810G |
| Shock | MIL-STD-810G |
Order the DS-1300
A strong Cincoze embedded computer with unmatched performance is the DS-1300. It offers extensive industrial I/O and a wide range of functions. Customization for additional I/O or other functionality to meet diverse applications is made simple with Cincoze’s CMI, CFM, and MEC modular extension. The DS-1300 is approved by industry standards and complies with the demands of industrial settings. For applications involving rolling stock, industrial automation, and factory automation, it provides the best possible performance.
