Cincoze
DX-1200
Built with 12th Gen Intel® Core™ i9/i7/i5/i3 (Alder Lake-S) processors (max 65 W TDP), the DX-1200 boasts up to 16 cores (8P + 8E) and 24 threads. Leverage Intel® Xe architecture for AI and edge computing applications.
Cincoze DX-1200 Specifications
System | |
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Processor | • 13th Generation Intel® Raptor Lake-S Series CPU: – Intel® Core™ i9-13900E 24 Cores Up to 5.2 GHz, TDP 65W – Intel® Core™ i7-13700E 16 Cores Up to 5.1 GHz, TDP 65W – Intel® Core™ i5-13500E 14 Cores Up to 4.6 GHz, TDP 65W – Intel® Core™ i5-13400E 10 Cores Up to 4.6 Ghz, TDP 65W – Intel® Core™ i3-13100E 4 Cores Up to 4.4 GHz, TDP 60W – Intel® Core™ i9-13900TE 24 Cores Up to 5.0 GHz, TDP 35W – Intel® Core™ i7-13700TE 16 Cores Up to 4.8 GHz, TDP 35W – Intel® Core™ i5-13500TE 14 Cores Up to 4.5 GHz, TDP 35W – Intel® Core™ i3-13100TE 4 Cores Up to 4.1 GHz, TDP 35W• 12th Generation Intel® Alder Lake-S Series CPU: – Intel® Core™ i9-12900E 16 Cores Up to 5 GHz, TDP 65W – Intel® Core™ i7-12700E 12 Cores Up to 4.8 GHz, TDP 65W – Intel® Core™ i5-12500E 6 Cores Up to 4.5 GHz, TDP 65W – Intel® Core™ i3-12100E 4 Cores Up to 4.2 GHz, TDP 60W – Intel® Core™ i9-12900TE 16 Cores Up to 4.8 GHz, TDP 35W – Intel® Core™ i7-12700TE 12 Cores Up to 4.7 GHz, TDP 35W – Intel® Core™ i5-12500TE 6 Cores Up to 4.3 GHz, TDP 35W – Intel® Core™ i3-12100TE 4 Cores Up to 4.0 GHz, TDP 35W – Intel® Pentium® G7400E 2 Cores Up to 3.6 GHz, TDP 46W – Intel® Pentium® G7400TE 2 Cores Up to 3.0 GHz, TDP 35W – Intel® Celeron® G6900E 2 Cores Up to 3.0 GHz, TDP 46W – Intel® Celeron® G6900TE 2 Cores Up to 2.4 GHz, TDP 35W |
Chipset | Intel R680E Chipset |
Memory | 2x DDR5 4800 MHz SO-DIMM Socket, Supports Un-buered and ECC Type, Up to 64GB |
BIOS | AMI BIOS |
Graphics | |
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Graphics Engine | • Integrated Intel® UHD Graphics 770: Core™ i9/i7/i5 • Integrated Intel® UHD Graphics 730: Core™ i3 • Integrated Intel® UHD Graphics 710: Pentium®/Celeron® |
Maximum Display output | Supports Quad Independent Display |
DVI | 1x DVI-I Connector – VGA: 1920 x 1080 @ 60 Hz – DVI-D: 1920 x 1200 @ 60 Hz |
DP | 1x DP Connector: 4096 x 2304 @ 60Hz *Verified maximum resolution: 3840 x 2160 @ 60Hz |
HDMI | 1x HDMI Connector: 3840 x 2160 @ 30Hz |
Operating System | |
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Windows | Windows®11, Windows® 10 |
Linux | Ubuntu 22.04 |
Audio | |
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Audio Codec | Realtek® ALC888, High Definition Audio |
Line-out | 1x Line-out, Phone Jack 3.5mm |
Mic-in | 1x Mic-in, Phone Jack 3.5mm |
DP | 1x DP Connector: 4096 x 2304 @ 60Hz *Verified maximum resolution: 3840 x 2160 @ 60Hz |
HDMI | 1x HDMI Connector: 3840 x 2160 @ 30Hz |
Power | |
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Power Button | 1x ATX Power On/O Button |
Power Mode Switch | 1x AT/ATX Mode Switch |
Power Input | 9-48VDC, 3-pin Terminal Block |
Remote Power On/Off | 1x Remote Power On/O, 2-pin Terminal Block |
I/O | |
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LAN | 2x 1GbE LAN, RJ45(Supports Wake on LAN, PXE) – GbE1: Intel® I219 – GbE2: Intel® I210 |
COM | 4x RS-232/422/485 with Auto Flow Control (Supports 5V/12V), DB9 |
USB | 4 x USB 3.2 Gen2x1 (10Gbps), Type A 4 x USB 3.2 Gen1x1 (5Gbps), Type A |
Storage | |
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SSD/HDD | 2x 2.5″ SATA HDD/SSD Bay (SATA 3.0) |
mSATA | 4 2x mSATA Socket (SATA 3.0, shared by Mini-PCIe socket ) |
RAID | Support RAID 0/1/5/10 |
Expansion | |
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Mini PCI Express | 2x Full-size Mini-PCIe Socket |
M.2 E Key Socket | 1x M.2 Key E Type 2230 Socket, Support Intel CNVi Module |
SIM Socket | 1x SIM Socket |
CMI (Combined Multiple I/O) Interface | 2x High Speed CMI Interface for optional CMI Module Expansion 1x Low Speed CMI Interface for optional CMI Module Expansion |
CFM (Control Function Module) Interface | 1x CFM IGN Interface for optional CFM-IGN Module Expansion |
Other Functions | |
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External FAN Connector | 1x External FAN Connector, 4-pin Terminal Block (Support Smart Fan by BIOS) |
Clear CMOS Switch | 1x Clear CMOS Switch |
Reset Button | 1x Reset Button |
Instant Reboot | Support 0.2sec Instant Reboot Technology |
Watchdog Timer | Software Programmable Supports 256 Levels System Reset |
Physical | |
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Dimension | 242 (w) x 173 (d) x 75 (h) mm |
Weight | 3.05kg |
Mechanical Construction | Extruded Aluminum with Heavy Duty Metal |
Mounting | Wall / DIN-RAIL / VESA / Side Mount |
Physical Design | – Fanless Design – Cableless Design – Jumper-less Design – Unibody Design |
Reliability & Protection | |
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Reverse Power Input Protection | Yes |
Over Voltage Protection | Protection Range: 51~58V Protection Type: shut down operating voltage, re-power on at the preset level to recover |
Over Current Protection | 15A |
CMOS Battery Backup | SuperCap Integrated for CMOS Battery Maintenance-free Operation |
MTBF | 394,488 Hours – Database: Telcordia SR-332 Issue3, Method 1, Case 3 |
Environment | |
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Operating Temperature | • 35W TDP Processor: -40°C to 70°C • 65W TDP Processor: -40°C to 50°C (With External Fan Kit) – With extended temperature peripherals; Ambient with air flow – According to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14 |
Storage Temperature | -40°C to 85°C |
Relative Humidity | 95% RH @ 70°C (Non-condensing) |
Shock & Vibration | MIL-STD-810G |
EMC | CE, UKCA, FCC, ICES-003 Class A EN 50155 (EN 50121-3-2 Only) E-Mark |
EMI | CISPR 32 Conducted & Radiated: Class A EN/BS EN 50121-3-2 Conducted & Radiated: Class A EN/BS EN IEC 61000-3-2 Harmonic current emissions: Class A EN/BS EN61000-3-3 Voltage fluctuations & flicker FCC 47 CFR Part 15B, ICES-003 Conducted & Radiated: Class A |
EMS | EN/IEC 61000-4-2 ESD: Contact: 6 kV; Air: 8 kV EN/IEC 61000-4-3 RS: 80 MHz to 1000 MHz: 20 V/m EN/IEC 61000-4-4 EFT: AC Power: 2 kV; Signal: 2 kV EN/IEC 61000-4-5 Surges: AC Power: 2 kV EN/IEC 61000-4-6 CS: 10V EN/IEC 61000-4-8 PFMF: 50 Hz, 1A/m EN/IEC 61000-4-11 Voltage Dips & Voltage Interruptions: 0.5 cycles at 50 Hz |
Safety | UL, cUL, CB, IEC, EN 62368-1 |
Fire Protection | EN 45545-2 |
Order the DX-1200
The DX-1200 is a Cincoze embedded fanless computer which supports 12th gen Intel® Core™ i9/i7/i5/i3 (Alder Lake-S) processors based on the Intel 7 process, with up to 16 cores (8P + 8E) and 24 threads, delivering more than 1.35x the processing performance of the Comet Lake-S platform. Support for up to 64GB of 4800MHz DDR5 memory with ECC technology, giving the extra stability and reliability needed for industrial automation and applications, effectively reducing the risk of failure and data loss.
The Intel® Xe architecture of the UHD 770 graphics chip boosts GPU image classification inference performance to 2.8× the speed of the Comet Lake-S platform, providing the processing performance needed for AI and edge computing.
DX-1200 Reliability Tested
Intel Alder Lake hybrid architecture is a new design that combines performance cores (P-core) and efficient cores (E-core_ in a single processor. Additionally, Intel’s latest manufacturing process, known as Intel 7 or 10nm Enhanced SuperFin, delivers a 10-15% boost in performance per watt, unlocking new levels of efficiency and power – and it’s all within the compact 3.2 liter DX-1200.