Cincoze
DX-1200
12th Gen. Intel® Core™ Series High Performance and Compact Rugged Embedded Computer
Rapid Processing and Interference
The DX-1200 supports 12th gen Intel® Core™ i9/i7/i5/i3 (Alder Lake-S) processors based on the Intel 7 process, with up to 16 cores (8P + 8E) and 24 threads, delivering more than 1.35x the speed of Comet Lake-S platform. The Intel® Xe architecture of the UHD 770 graphics chip boosts GPU image classification inference performance to 2.8× the speed of Comet Lake-S, providing the processing performance needed for AI and edge computing.
High-Speed, Reliable Data Transmission
To improve the transfer rate of videos or large files, the DX-1200 supports up to four high-speed 10Gbps LAN ports. And for application environments that require multiple network connections, the DX-1200 supports up to 8× PoE, providing data and power through the same cable to reduce the difficulty of wiring.
Rich & Diverse Expandability
To cater to the widest range of industrial applications, the DX-1200 provides one M.2 Key E slot and two Mini PCIe slots for the addition of WiFi, GNSS, 4G, and Bluetooth. The Mini PCIe slots also support I/O expansion cards, frame grabber cards, and more, to meet different application requirements.
High-Speed, Safe Memory
Two DDR5 SO-DIMM slots support up to 64GB of 4800MHz memory and include ECC (Error Correction Code) technology, giving the extra stability and reliability needed for industrial automation applications.
Cincoze DX-1200 Specifications
| System | |
| Processor | 12th Generation Intel® Alder Lake-S Series CPU: - Intel® Core™ i9-12900E 16 Cores Up to 5 GHz, TDP 65W - Intel® Core™ i7-12700E 12 Cores Up to 4.8 GHz, TDP 65W - Intel® Core™ i5-12500E 6 Cores Up to 4.5 GHz, TDP 65W - Intel® Core™ i3-12100E 4 Cores Up to 4.2 GHz, TDP 60W - Intel® Core™ i9-12900TE 16 Cores Up to 4.8 GHz, TDP 35W - Intel® Core™ i7-12700TE 12 Cores Up to 4.7 GHz, TDP 35W - Intel® Core™ i5-12500TE 6 Cores Up to 4.3 GHz, TDP 35W - Intel® Core™ i3-12100TE 4 Cores Up to 4.0 GHz, TDP 35W - Intel® Pentium® G7400E 2 Cores Up to 3.6 GHz, TDP 46W - Intel® Pentium® G7400TE 2 Cores Up to 3.0 GHz, TDP 35W - Intel® Celeron® G6900E 2 Cores Up to 3.0 GHz, TDP 46W - Intel® Celeron® G6900TE 2 Cores Up to 2.4 GHz, TDP 35W |
| Chipset | Intel R680E Chipset |
| Graphics | Integrated Intel® UHD Graphics 770: Core™ i9/i7/i5 Integrated Intel® UHD Graphics 730: Core™ i3 Integrated Intel® UHD Graphics 710: Pentium®/Celeron® |
| Memory | 2x DDR5 4800 MHz SO-DIMM Socket, Supports Un-buffered and ECC Type, Up to 64GB |
| TPM | Supports dTPM 2.0 |
| I/O | |
| Ethernet | 4x 2.5GBASE-T Ethernet ports by Intel® I226-IT GbE controllers |
| PoE+ | Optional IEEE 802.3at PoE+ PSE for 4x2.5GbE ports 100 W total power budget |
| Video | 1x VGA output, supporting 1920 x 1200 resolution 1x DisplayPort, supporting 4096 x 2304 resolution |
| USB | 4x USB 3.2 Gen1 (5 Gbps) ports 2x USB 2.0 ports |
| Serial | 1x software-programmable RS-232/422/485 ports (COM1) 3x 3-wire RS-232 ports (COM2/3/4) or 1x RS-422/485 port (COM2) |
| Audio | 1x 3.5 mm jack for mic-in and speaker-out |
| Expansion | |
| Mini PCI Express | 2x full-size mini PCI Express sockets with internal SIM sockets |
| M.2 | 1x M.2 2280 M key socket (PCIe Gen4 x4) for NVMe SSD |
| Storage | |
| SATA | 1x hot-swappable 2.5" HDD/ SSD tray for 7mm HDD/ SSD |
| M.2 NVME | 1x M.2 2280 M key socket (PCIe Gen4 x4) for NVMe SSD |
| Power Supply | |
| Input | 1x 3-pin pluggable terminal block for 8 to 48V DC input with optional ignition power control |
| Mechanical | |
| Dimensions | 212 mm (W) x 165 mm (D) x 63 mm (H) |
| Weight | 2.5kg |
| Mounting | Wall-mount (standard) or DIN-rail mount (optional) |
| Environmental | |
| Operating Temperature | with 35W CPU -25°C ~ 70°C |
| Storage Temperature | -40°C ~ 85°C |
| Humidity | 10%~90%, non-condensing |
| Vibration | Operating, MIL-STD-810G, Method 514.6, Category 4 |
| Shock | Operating, MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II |
Order the DX-1200
The DX-1200 is a Cincoze embedded fanless computer which supports 12th gen Intel® Core™ i9/i7/i5/i3 (Alder Lake-S) processors based on the Intel 7 process, with up to 16 cores (8P + 8E) and 24 threads, delivering more than 1.35x the processing performance of the Comet Lake-S platform. Support for up to 64GB of 4800MHz DDR5 memory with ECC technology, giving the extra stability and reliability needed for industrial automation and applications, effectively reducing the risk of failure and data loss.
The Intel® Xe architecture of the UHD 770 graphics chip boosts GPU image classification inference performance to 2.8× the speed of the Comet Lake-S platform, providing the processing performance needed for AI and edge computing.
DX-1200 Reliability Tested
Intel Alder Lake hybrid architecture is a new design that combines performance cores (P-core) and efficient cores (E-core_ in a single processor. Additionally, Intel’s latest manufacturing process, known as Intel 7 or 10nm Enhanced SuperFin, delivers a 10-15% boost in performance per watt, unlocking new levels of efficiency and power – and it’s all within the compact 3.2 liter DX-1200.
