CINCOZE
DX-1200

Built with 12th Gen Intel® Core™ i9/i7/i5/i3 (Alder Lake-S) processors (max 65 W TDP), the DX-1200 boasts up to 16 cores (8P + 8E) and 24 threads.
Leverage Intel® Xe architecture for AI and edge computing applications.

Cincoze DX-1200 Offers 12th Gen Intel Performance

DX-1200 Product Highlights:

  • Intel® 12th Gen Alder Lake-S Core™ i9/i7/i5/i3 Processors (max 65 W TDP)
  • 2 x DDR5 SO-DIMM Sockets, Supports ECC/non ECC type Memory, Up to 4800MHZ, 64GB
  • Quad Independent Display (HDMI / DP / DVI-I)
  • 1x M.2 Key E Type 2230 Socket for Intel CNVi / Wireless Module
  • CMI Technology for Optional I/O Module Expansions
  • CFM Technology for Power Ignition Sensing & PoE Function
  • Wide Operating Temperature -40°C to 70°C
  • Safety Standard: UL, c-UL, CB, IEC, EN 62368-1

DX-1200

Specifications

System
Processor • 13th Generation Intel® Raptor Lake-S Series CPU:
– Intel® Core™ i9-13900E 24 Cores Up to 5.2 GHz, TDP 65W
– Intel® Core™ i7-13700E 16 Cores Up to 5.1 GHz, TDP 65W
– Intel® Core™ i5-13500E 14 Cores Up to 4.6 GHz, TDP 65W
– Intel® Core™ i5-13400E 10 Cores Up to 4.6 Ghz, TDP 65W
– Intel® Core™ i3-13100E 4 Cores Up to 4.4 GHz, TDP 60W
– Intel® Core™ i9-13900TE 24 Cores Up to 5.0 GHz, TDP 35W
– Intel® Core™ i7-13700TE 16 Cores Up to 4.8 GHz, TDP 35W
– Intel® Core™ i5-13500TE 14 Cores Up to 4.5 GHz, TDP 35W
– Intel® Core™ i3-13100TE 4 Cores Up to 4.1 GHz, TDP 35W• 12th Generation Intel® Alder Lake-S Series CPU:
– Intel® Core™ i9-12900E 16 Cores Up to 5 GHz, TDP 65W
– Intel® Core™ i7-12700E 12 Cores Up to 4.8 GHz, TDP 65W
– Intel® Core™ i5-12500E 6 Cores Up to 4.5 GHz, TDP 65W
– Intel® Core™ i3-12100E 4 Cores Up to 4.2 GHz, TDP 60W
– Intel® Core™ i9-12900TE 16 Cores Up to 4.8 GHz, TDP 35W
– Intel® Core™ i7-12700TE 12 Cores Up to 4.7 GHz, TDP 35W
– Intel® Core™ i5-12500TE 6 Cores Up to 4.3 GHz, TDP 35W
– Intel® Core™ i3-12100TE 4 Cores Up to 4.0 GHz, TDP 35W
– Intel® Pentium® G7400E 2 Cores Up to 3.6 GHz, TDP 46W
– Intel® Pentium® G7400TE 2 Cores Up to 3.0 GHz, TDP 35W
– Intel® Celeron® G6900E 2 Cores Up to 3.0 GHz, TDP 46W
– Intel® Celeron® G6900TE 2 Cores Up to 2.4 GHz, TDP 35W
Chipset Intel R680E Chipset
Memory 2x DDR5 4800 MHz SO-DIMM Socket, Supports Un-buered and ECC Type, Up to 64GB
BIOS AMI BIOS
Graphics
Graphics Engine • Integrated Intel® UHD Graphics 770: Core™ i9/i7/i5
• Integrated Intel® UHD Graphics 730: Core™ i3
• Integrated Intel® UHD Graphics 710: Pentium®/Celeron®
Maximum Display output Supports Quad Independent Display
DVI 1x DVI-I Connector
– VGA: 1920 x 1080 @ 60 Hz
– DVI-D: 1920 x 1200 @ 60 Hz
DP 1x DP Connector: 4096 x 2304 @ 60Hz
*Verified maximum resolution: 3840 x 2160 @ 60Hz
HDMI 1x HDMI Connector: 3840 x 2160 @ 30Hz
Reliability & Protection
Reverse Power Input Protection Yes
Over Voltage Protection Protection Range: 51~58V
Protection Type: shut down operating voltage, re-power on at the preset level to recover
Over Current Protection 15A
CMOS Battery Backup SuperCap Integrated for CMOS Battery Maintenance-free Operation
MTBF 394,488 Hours – Database: Telcordia SR-332 Issue3, Method 1, Case 3
Audio
Audio Codec Realtek® ALC888, High Definition Audio
Line-out 1x Line-out, Phone Jack 3.5mm
Mic-in 1x Mic-in, Phone Jack 3.5mm
DP 1x DP Connector: 4096 x 2304 @ 60Hz
*Verified maximum resolution: 3840 x 2160 @ 60Hz
HDMI 1x HDMI Connector: 3840 x 2160 @ 30Hz
I/O
LAN 2x 1GbE LAN, RJ45(Supports Wake on LAN, PXE)
– GbE1: Intel® I219
– GbE2: Intel® I210
COM 4x RS-232/422/485 with Auto Flow Control (Supports 5V/12V), DB9
USB 4 x USB 3.2 Gen2x1 (10Gbps), Type A
4 x USB 3.2 Gen1x1 (5Gbps), Type A
Power
Power Button 1x ATX Power On/O Button
Power Mode Switch 1x AT/ATX Mode Switch
Power Input 9-48VDC, 3-pin Terminal Block
Remote Power On/Off 1x Remote Power On/O, 2-pin Terminal Block
Expansion
Mini PCI Express 2x Full-size Mini-PCIe Socket
M.2 E Key Socket 1x M.2 Key E Type 2230 Socket, Support Intel CNVi Module
SIM Socket 1x SIM Socket
CMI (Combined Multiple I/O) Interface 2x High Speed CMI Interface for optional CMI Module Expansion
1x Low Speed CMI Interface for optional CMI Module Expansion
CFM (Control Function Module) Interface 1x CFM IGN Interface for optional CFM-IGN Module Expansion
Other Functions
External FAN Connector 1x External FAN Connector, 4-pin Terminal Block (Support Smart Fan by BIOS)
Clear CMOS Switch 1x Clear CMOS Switch
Reset Button 1x Reset Button
Instant Reboot Support 0.2sec Instant Reboot Technology
Watchdog Timer Software Programmable Supports 256 Levels System Reset
Physical
Dimension 242 (w) x 173 (d) x 75 (h) mm
Weight 3.05kg
Mechanical Construction Extruded Aluminum with Heavy Duty Metal
Mounting Wall / DIN-RAIL / VESA / Side Mount
Physical Design – Fanless Design
– Cableless Design
– Jumper-less Design
– Unibody Design
Operating System
Windows Windows®11, Windows® 10
Linux Ubuntu 22.04
Environment
Operating Temperature • 35W TDP Processor: -40°C to 70°C
• 65W TDP Processor: -40°C to 50°C (With External Fan Kit)
– With extended temperature peripherals; Ambient with air flow
– According to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14
Storage Temperature -40°C to 85°C
Relative Humidity 95% RH @ 70°C (Non-condensing)
Shock & Vibration MIL-STD-810G
EMC CE, UKCA, FCC, ICES-003 Class A
EN 50155 (EN 50121-3-2 Only)
E-Mark
EMI CISPR 32 Conducted & Radiated: Class A
EN/BS EN 50121-3-2 Conducted & Radiated: Class A
EN/BS EN IEC 61000-3-2 Harmonic current emissions: Class A
EN/BS EN61000-3-3 Voltage fluctuations & flicker
FCC 47 CFR Part 15B, ICES-003 Conducted & Radiated: Class A
EMS EN/IEC 61000-4-2 ESD: Contact: 6 kV; Air: 8 kV
EN/IEC 61000-4-3 RS: 80 MHz to 1000 MHz: 20 V/m
EN/IEC 61000-4-4 EFT: AC Power: 2 kV; Signal: 2 kV
EN/IEC 61000-4-5 Surges: AC Power: 2 kV
EN/IEC 61000-4-6 CS: 10V
EN/IEC 61000-4-8 PFMF: 50 Hz, 1A/m
EN/IEC 61000-4-11 Voltage Dips & Voltage Interruptions: 0.5 cycles at 50 Hz
Safety UL, cUL, CB, IEC, EN 62368-1
Fire Protection EN 45545-2
Storage
SSD/HDD 2x 2.5″ SATA HDD/SSD Bay (SATA 3.0)
mSATA 4 2x mSATA Socket (SATA 3.0, shared by Mini-PCIe socket )
RAID Support RAID 0/1/5/10
VIEW & PRINT DX-1200 DATASHEET

Order the DX-1200

The DX-1200 is a Cincoze embedded fanless computer which supports 12th gen Intel® Core™ i9/i7/i5/i3 (Alder Lake-S) processors based on the Intel 7 process, with up to 16 cores (8P + 8E) and 24 threads, delivering more than 1.35x the processing performance of the Comet Lake-S platform. Support for up to 64GB of 4800MHz DDR5 memory with ECC technology, giving the extra stability and reliability needed for industrial automation and applications, effectively reducing the risk of failure and data loss.

The Intel® Xe architecture of the UHD 770 graphics chip boosts GPU image classification inference performance to 2.8× the speed of the Comet Lake-S platform, providing the processing performance needed for AI and edge computing.

dx1200

Rapid Processing and Interference

The DX-1200 supports 12th gen Intel® Core™ i9/i7/i5/i3 (Alder Lake-S) processors based on the Intel 7 process, with up to 16 cores (8P + 8E) and 24 threads, delivering more than 1.35x the speed of Comet Lake-S platform. The Intel® Xe architecture of the UHD 770 graphics chip boosts GPU image classification inference performance to 2.8× the speed of Comet Lake-S, providing the processing performance needed for AI and edge computing.

High-Speed, Reliable Data Transmission

To improve the transfer rate of videos or large files, the DX-1200 supports up to four high-speed 10Gbps LAN ports. And for application environments that require multiple network connections, the DX-1200 supports up to 8× PoE, providing data and power through the same cable to reduce the difficulty of wiring.

High-Speed, Safe Memory

Two DDR5 SO-DIMM slots support up to 64GB of 4800MHz memory and include ECC (Error Correction Code) technology, giving the extra stability and reliability needed for industrial automation applications.

Rich & Diverse Expandability

To cater to the widest range of industrial applications, the DX-1200 provides one M.2 Key E slot and two Mini PCIe slots for the addition of WiFi, GNSS, 4G, and Bluetooth. The Mini PCIe slots also support I/O expansion cards, frame grabber cards, and more, to meet different application requirements.

DX1200 12th Gen

DX-1200 Reliability Tested

Intel Alder Lake hybrid architecture is a new design that combines performance cores (P-core) and efficient cores (E-core_ in a single processor. Additionally, Intel’s latest manufacturing process, known as Intel 7 or 10nm Enhanced SuperFin, delivers a 10-15% boost in performance per watt, unlocking new levels of efficiency and power – and it’s all within the compact 3.2 liter DX-1200.

Shock & Vibration Proof

MIL-STD 810G

Highest Military Standard Certified

Railway Standard

EN 50155 / EN 45545-2

In-Vehicle Standard

E-mark

In-vehicle Electromagnetic Compatibility

Safety Certification

UL Listed

UL / c-UL / CB / EN 62368-1

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