This is a common concern, but our passively cooled computers are specifically engineered to manage heat effectively. While there is a limit to the heat they can dissipate (measured by Thermal Design Power or TDP), they can be configured with powerful processors, including multi-core Intel® Core™ i3, i5, and i7 CPUs. The key is proper engineering:
- We use highly efficient, low-power mobile and embedded CPUs.
- The entire chassis is an oversized, purpose-built aluminum heat sink.
- Advanced thermal interface materials ensure maximum heat transfer from the processor to the chassis.
For a given application, we will always ensure the selected PC has the appropriate thermal capacity for the installed components.











