DV-1100
PRODUCT HIGHLIGHTS
- Intel® 13/12th Gen. Core™ i9/i7/i5/i3 Processors (max 65 W TDP)
- 1x M.2 Key M Type 2280 Socket for PCIe Gen 4×4 NVMe Storage
- 1x M.2 Key E Type 2230 Socket for Wireless/Intel CNVi Module Expansion
- 1x M.2 Key B Type 3052/3042 Socket for 5G/Storage/Add-on Card Expansion
- 1x M.2 Key B Type 2242 Socket for Storage/Add-on Card Expansion
- Optional CMI & CFM Modules for I/O Expansion & Power Ignition Sensing Function
- Wide operating temperature -40°C to 70°C
- Safety Standard: UL, cUL, CB, IEC, EN 62368-1
About the Computer
Cincoze DV-1100 Embedded Computer
The DV-1100 is a compact, high-performance, embedded edge computer that supports 13th/12th generation Intel® processors. Its balance between high-performance computing needs and cost-effectiveness enables enterprises to quickly analyze and process edge data for better decision-making and improved production efficiency and accuracy.
The DV-1100 is ideal for smart manufacturing, machine vision, railway computing, and space-constrained applications where stability and reliability are paramount.
About the Distributor
Industrial PC, Inc.
Industrial PC, Inc. is your US-leader in industrial computing since 1996. We’ll help you find the right solution, provide custom integrations, and deliver your computer(s) ready-to-use upon arrival.
Our US-based support prides itself in communicating with you every step of the way.
Feel free to place your order on this page, or reach out to us any time if you have questions or need assistance making sure you find the right product and configuration.
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DV-1100
Specifications
| System | |
|---|---|
| Processor | 13th Generation Intel® Raptor Lake-S Series CPU: • Intel® Core™ i9-13900E 24 Cores Up to 5.2 GHz, TDP 65W • Intel® Core™ i7-13700E 16 Cores Up to 5.1 GHz, TDP 65W • Intel® Core™ i5-13500E 14 Cores Up to 4.6 GHz, TDP 65W • Intel® Core™ i5-13400E 10 Cores Up to 4.6 GHz, TDP 65W • Intel® Core™ i3-13100E 4 Cores Up to 4.4 GHz, TDP 60W • Intel® Core™ i9-13900TE 24 Cores Up to 5.0 GHz, TDP 35W • Intel® Core™ i7-13700TE 16 Cores Up to 4.8 GHz, TDP 35W • Intel® Core™ i5-13500TE 14 Cores Up to 4.5 GHz, TDP 35W • Intel® Core™ i3-13100TE 4 Cores Up to 4.1 GHz, TDP 35W12th Generation Intel® Alder Lake-S Series CPU: • Intel® Core™ i9-12900E 16 Cores Up to 5.0 GHz, TDP 65W • Intel® Core™ i7-12700E 12 Cores Up to 4.8 GHz, TDP 65W • Intel® Core™ i5-12500E 6 Cores Up to 4.5 GHz, TDP 65W • Intel® Core™ i3-12100E 4 Cores Up to 4.2 GHz, TDP 60W • Intel® Core™ i9-12900TE 16 Cores Up to 4.8 GHz, TDP 35W • Intel® Core™ i7-12700TE 12 Cores Up to 4.7 GHz, TDP 35W • Intel® Core™ i5-12500TE 6 Cores Up to 4.3 GHz, TDP 35W • Intel® Core™ i3-12100TE 4 Cores Up to 4.0 GHz, TDP 35W • Intel® Pentium® G7400E 2 Cores Up to 3.6 GHz, TDP 46W • Intel® Pentium® G7400TE 2 Cores Up to 3.0 GHz, TDP 35W • Intel® Celeron® G6900E 2 Cores Up to 3.0 GHz, TDP 46W • Intel® Celeron® G6900TE 2 Cores Up to 2.4 GHz, TDP 35W |
| Chipset | Intel H610E Chipset |
| Graphics | • Integrated Intel® UHD Graphics 770: Core™ i9/i7/i5 • Integrated Intel® UHD Graphics 730: Core™ i3 • Integrated Intel® UHD Graphics 710: Pentium®/Celeron® |
| Memory | 1x DDR5 4800MHz SO-DIMM Socket Supports Un-buffered and non-ECC Type, Up to 32GB |
| BIOS | AMI BIOS |
| Storage | |
|---|---|
| SSD/HDD | 1x 2.5″ SATA HDD/SSD Bay (SATA 3.0) |
| M.2 SDD | • 1x M.2 SSD Shared by M.2 Key M Type 2280 Socket, Support PCIe Gen 4×4 NVMe SSD or SATA 3.0 SSD • 2x M.2 SSD Shared by M.2 Key B Socket, Support PCIe Gen 3×2 NVMe SSD or SATA 3.0 SSD |
| Mechanical | |
|---|---|
| Dimensions | 224.1 x 162 x 62 mm |
| Weight | 2.52kg |
| Mounting | Wall / DIN-RAIL / VESA Mount |
| I/O | |
|---|---|
| LAN | • 1x 2.5GbE LAN, RJ45 – Intel® I225 • 1x 1GbE LAN, RJ45 – Intel® I219 |
| COM | 2x RS-232/422/485 with Auto Flow Control (Supports 5V/12V), DB9 |
| USB | • 1x 10Gbps USB3.2 Gen 2×1, Type A • 2x 5Gbps USB3.2 Gen 1×1, Type A • 3x 480Mbps USB2.0, Type A |
| Audio | 1x 3.5 mm jack for mic-in and speaker-out |
| Expansion | |
|---|---|
| M.2 Key E Socket | 1x M.2 Key E Type 2230 Socket (PCIe Gen 3×2 / USB2.0), Support Wireless/Intel CNVi Module Expansion |
| M.2 Key B Socket | • 1x M.2 Key B Type 3042/3052 Socket (PCIe Gen 3×2 / USB3.2 Gen2 x1 / USB2.0 / SATA), Support 5G/Storage/Add-on Card Expansion • 1x M.2 Key B Type 2242 Socket (PCIe Gen 3×2 / USB2.0 / SATA ), Support Storage/Add-on Card Expansion |
| SIM Socket | 1x Front Accessible Dual Nano SIM Socket |
| CMI Interface | • 1x CMI Interface for optional CMI-Display Module Expansion • 2x CMI Interface for optional CMI-COM/DIO Module Expansion |
| CFM Interface | 1x CFM IGN Interface for optional CFM-IGN Module Expansion |
| Environmental | |
|---|---|
| Operating Temperature | • 35W TDP Processor: -40°C to 70°C • 65W TDP Processor: -40°C to 55°C (With External Fan Kit) * PassMark BurnInTest: 100% CPU, 2D/3D Graphics (without thermal throttling) * With extended temperature peripherals; Ambient with air flow * According to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14 |
| Storage Temperature | -40°C ~ 70°C |
| Humidity | 95% RH @ 70°C, non-condensing |
| Vibration | MIL-STD-810H |
| Shock | MIL-STD-810H |
| Power Supply | |
|---|---|
| Input | 9 – 48VDC, 3-pin Terminal Block |
The US-Leader in Industrial Computing Since 1996
Founded in 1996, Industrial PC, Inc. has grown to become the leader in high-performance, industrial-grade computing solutions for the most rugged and demanding environments.
Headquartered in Indianapolis, our team of experienced and trusted experts is dedicated to providing our clients throughout the world with a host of state-of-the-art industrial computer solutions to meet their precise needs.
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