NEOUSYS
POC-700 Series

Intel® Core™ i3-N305/ Atom® x7425E Ultra-compact Embedded Computer with 4x PoE+, USB 3.2, and MezIO® Interface

One of Industry’s First Core i Ultra-compact Fanless Embedded Computers

POC-700 is Neousys’ next-generation ultra-compact embedded controller, with a choice of the latest Intel® Alder Lake i3-N305 or x7425E processor that is capable of delivering up to 1.3x the CPU performance when compared to previous POC-500 series.

Product Highlights:

  • Intel® Alder Lake Core™ i3-N305 processor 15W with 8 E-Cores or Atom® x7425E
  • Up to 16GB DDR5-4800 SODIMM
  • -25 °C to 70 °C rugged wide temperature operation
  • 4x GbE ports PoE+ / 4x USB3.2 Gen 2 with screw-lock
  • M.2 2280 M key SATA socket
  • DP++ / HDMI 1.4b dual display outputs
  • 4-CH isolated DI + 4-CH isolated DO
  • Front I/O access DIN-mounting design
  • MezIO® compatible

Comparing the POC-712 and POC-715 Series:

POC-712

Intel Atom x7425E Ultra-Compact Embedded Controller with 4x GbE, 4x USB 3.2 and MezIO Interface.

POC-715

Intel Core i3-N305 Ultra-Compact Embedded Controller with 4x PoE+, 4x USB 3.2 and MezIO Interface.

Introducing the Neousys POC-700

Industrial Power in a Compact Package

Neousys POC-700 is powered by Intel’s Alder Lake i3-N305 featuring 8-core/ 8-thread processor with 32EUs UHD Graphics or Atom® x7425E featuring 4-core/ 4-thread with 24EUs UHD Graphics to support Intel OpenVINO™ for AI inference capabilities. The systems adopts DDR5-4800 to offer up to 1.8x the memory bandwidth over DDR4 to boost overall system performance.

It also has four USB3.2 Gen2, and four GigE PoE+ ports with screw lock mechanisms to connect and secure industrial cameras for machine vision applications. Display output wise, there are HDMI and DP video outputs to support high-definition display devices. As for connections and expansions, POC-700 features isolated DIO for device monitoring/control, M.2 2280 M key for SATA SSD and a mini-PCIe socket for wireless WiFi, LTE/5G or CAN bus device.

POC-700 Series Specifications

System
Processor POC-715
Intel® Alder Lake Core™ i3-N305 processor (8C/8T, 1.8/3.8 GHz, 15W TDP)

POC-712
Intel® Alder Lake Atom® x7425E processor (4C/4T, 1.5 /3.4 GHz, 12W TDP)
Graphics POC-715
Integrated Intel® UHD Graphics with 32EUs

POC-712
Integrated Intel® UHD Graphics with 24EUs
Memory Up to 16 GB DDR5-4800 SDRAM (one SODIMM socket)
TPM Supports TPM 2.0 (fTPM/ dTPM)
Panel I/O Interface
Ethernet 4x Gb Ethernet ports by Intel® I350-AM4
PoE+ POC-715
IEEE 802.3at PoE+ on port #1~ 4

POC-712
n/a
Native Video Port 1x DP++, Supporting 4096 x 2160 resolution
1x HDMI1.4b, Supporting 3840 x 2160 30Hz
USB 4x USB 3.2 Gen2 ports with screw-lock
Serial Port 1x Software-programmable RS-232/422/485 ports (COM1)
3x 3-wire RS-232 ports (COM2/3/4) or 1x RS-422/485 port (COM2)
Isolated DIO 4-CH isolated DI and 4-CH isolated DO
Expansion Bus
Mini PCIe 1x full-size mini PCI Express socket with internal micro SIM socket
Expandable I/O 1x MezIO® expansion interface for Neousys MezIO® modules
Power Supply
DC Input 1x 3-pin pluggable terminal block for 8 to 35V DC input
Remote Ctrl.& LED Output 1x 3-pin pluggable terminal block for remote control and PWR LED output
Mechanical
Dimensions 64 (W) x 116 (D) x 176 (H) mm
Weight 1.2kg
Mounting DIN-rail mount (standard) or wall-mount (optional)
Fan Optional external-accessible 80mm x 80mm fan for system heat dissipation
Environmental
Operating Temperature -25°C ~ 70°C*
Storage Temperature -40°C ~ 85°C
Humidity 10%~90%, non-condensing
Vibration Operating, MIL-STD-810G, Method 514.6, Category 4
Shock Operating, MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II
Safety EN62368-1
EMC CE/ FCC Class A, according to EN 55032 & EN 55024

Order the POC-700

Measuring just 64 x 116 x 176mm, the ultra-compact POC-700 can easily fit into confined spaces and is a seamless upgrade from POC-500 series with identical footprint.

Benefiting from the performance gains of the latest Intel CPU, wide-temperature fanless design, and ample interfaces for industrial cameras and I/Os, POC-700 is perfect for machine vision and smart city applications.