| System | |
|---|---|
| CPU | AMD Ryzen V1605B |
| Chipset | SoC |
| Graphics | Vega GPU with 6 compute units |
| Memory | 8GB |
| Lifecycle (Availability) | Target 2028 |
| I/O | |
|---|---|
| Ethernet | 4x PoE |
| USB | 4x USB 3.1 Gen 1 (5 Gbps) |
| Serial | 3x RS-2321x RS-232/422/485 |
| DIO | 4-CH DIO |
| Video | 1x VGA1x DisplayPort |
| Audio | 1x 3.5mm jack for Mic-In and Speaker-Out |
| Expansion | |
|---|---|
| Mini-PCIe | 3x Mini-PCIe |
| M.2 | 1x M.2 |
| Storage | |
|---|---|
| M.2 | Up to 512GB NVME |
| Mechanical | |
|---|---|
| Dimensions | 64mm x 116mm x 176mm2.52″ x 4.57″ x 6.93″ |
| Weight | 1.3 kg2.87 lbs |
| Environment | |
|---|---|
| Operating Temp. | -25-70℃ |
| Storage Temp. | -40-85℃ |
| Humidity | 10%~90%, non-condensing |
| Shock | MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II |
| Vibration | MIL-STD-810G, Method 514.6, Category 4 |
| System | |
|---|---|
| CPU | AMD Ryzen V1807B |
| Chipset | SoC |
| Graphics | Vega GPU with 11 compute units |
| Memory | 8GB |
| Lifecycle (Availability) | Target 2028 |
| I/O | |
|---|---|
| Ethernet | Additional 4x GigE ports by 4x Intel® I210 controllers, supporting 9.5 kB jumbo frame via MezIO-G4Additional 4x PoE+ ports by 4x Intel® I210 controllers, supporting 9.5 kB jumbo frame via MezIO-G4P |
| USB | Additional 4x USB 3.1 ports via MezIO-U4-50 |
| Serial | Additional 4x RS-232/422/485 + 4x RS-232 ports via MezIO-C180-50Additional 4x RS-232/422/485 + 4x RS-422/485 ports via MezIO-C181-50 |
| Video | 1x VGA1x DisplayPort |
| Audio | 1x 3.5mm jack for Mic-In and Speaker-Out |
| Isolated Digital I/O | 16-CH isolated DI + 16-CH isolated DO via MezIO-D230-508-CH isolated DI + 8-CH isolated DO via MezIO-D220-50 |
| Expansion | |
|---|---|
| Mini-PCIe | 1x Mini-PCIe |
| Storage | |
|---|---|
| M.2 | Up to 512GB NVME |
| Mechanical | |
|---|---|
| Dimensions | 81mm x 118mm x 176mm3.19″ x 4.65″ x 6.93″ |
| Weight | 1.4 kg3.09 lbs |
| Environment | |
|---|---|
| Operating Temp. | -25-70℃ |
| Storage Temp. | -40-85℃ |
| Humidity | 10%~90%, non-condensing |
| Shock | MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II |
| Vibration | MIL-STD-810G, Method 514.6, Category 4 |
| System | |
|---|---|
| CPU | AMD Ryzen V1605B |
| Chipset | SoC |
| Graphics | Vega GPU with 8 compute units |
| Memory | 8GB |
| Lifecycle (Availability) | Target 2028 |
| I/O | |
|---|---|
| Ethernet | Additional 4x GigE ports by 4x Intel® I210 controllers, supporting 9.5 kB jumbo frame via MezIO-G4Additional 4x PoE+ ports by 4x Intel® I210 controllers, supporting 9.5 kB jumbo frame via MezIO-G4P |
| USB | Additional 4x USB 3.1 ports via MezIO-U4-50 |
| Serial | Additional 4x RS-232/422/485 + 4x RS-232 ports via MezIO-C180-50Additional 4x RS-232/422/485 + 4x RS-422/485 ports via MezIO-C181-50 |
| Video | 1x VGA1x DisplayPort |
| Audio | 1x 3.5mm jack for Mic-In and Speaker-Out |
| Isolated Digital I/O | 16-CH isolated DI + 16-CH isolated DO via MezIO-D230-508-CH isolated DI + 8-CH isolated DO via MezIO-D220-50 |
| Expansion | |
|---|---|
| Mini-PCIe | 1x Mini-PCIe |
| Storage | |
|---|---|
| M.2 | Up to 512GB M.2 |
| Mechanical | |
|---|---|
| Dimensions | 64mm x 116mm x 176mm2.52″ x 4.57″ x 6.93″ |
| Weight | 1.2 kg2.65 lbs |
| Environment | |
|---|---|
| Operating Temp. | -25-70℃ |
| Storage Temp. | -40-85℃ |
| Humidity | 10%~90%, non-condensing |
| Shock | MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II |
| Vibration | MIL-STD-810G, Method 514.6, Category 4 |
| System | |
|---|---|
| CPU | Intel Atom x6425E |
| Chipset | SoC |
| Graphics | UHD Graphics |
| Memory | 8GB |
| Lifecycle (Availability) | Target 2028 |
| I/O | |
|---|---|
| Ethernet | 1x 2.5GbE2x PoE |
| USB | 2x USB 3.2 Gen 1x1 (5 Gbps)2x USB 2.0 |
| Serial | 3x RS-2321x RS-232/422/485 |
| DIO | 4-CH DIO |
| Video | 2x DisplayPort |
| Expansion | |
|---|---|
| Mini-PCIe | 1x Mini-PCIe |
| M.2 | 2x M.2 |
| Storage | |
|---|---|
| M.2 | Up to 512GB M.2 |
| Mechanical | |
|---|---|
| Dimensions | 153mm x 108mm x 72mm6.02″ x 4.25″ x 2.83″ |
| Weight | 0.96 kg2.12 lbs |
| Environment | |
|---|---|
| Operating Temp. | -25-70℃ |
| Storage Temp. | -40-85℃ |
| Humidity | 10%~90%, non-condensing |
| Shock | MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II |
| Vibration | MIL-STD-810G, Method 514.6, Category 4 |
| System | |
|---|---|
| CPU | Intel Atom x6425E |
| Chipset | SoC |
| Graphics | UHD Graphics |
| Memory | 8GB |
| Lifecycle (Availability) | Target 2028 |
| I/O | |
|---|---|
| Ethernet | 3x 2.5GbE |
| USB | 2x USB 3.1 Gen 1 (5 Gbps)2x USB 2.0 |
| Serial | 3x RS-2321x RS-232/422/485 |
| Video | 2x DisplayPort |
| Expansion | |
|---|---|
| M.2 | 1x M.2 |
| Storage | |
|---|---|
| M.2 | Up to 512GB M.2 |
| Mechanical | |
|---|---|
| Dimensions | 56mm x 108mm x 153mm2.2″ x 4.25″ x 6.02″ |
| Weight | 0.96 kg2.12 lbs |
| Environment | |
|---|---|
| Operating Temp. | -25-70℃ |
| Storage Temp. | -40-85℃ |
| Humidity | 10%~90%, non-condensing |
| Shock | MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II |
| Vibration | MIL-STD-810G, Method 514.6, Category 4 |
| System | |
|---|---|
| CPU | Intel Atom x6425E |
| Chipset | SoC |
| Graphics | UHD Graphics |
| Memory | 8GB |
| Lifecycle (Availability) | Target 2028 |
| I/O | |
|---|---|
| Ethernet | 1x 2.5GbE2x PoE |
| USB | 2x USB 3.1 Gen 1 (5 Gbps)2x USB 2.0 |
| Serial | 3x RS-2321x RS-232/422/485 |
| Video | 2x DisplayPort |
| Expansion | |
|---|---|
| M.2 | 1x M.2 |
| Storage | |
|---|---|
| M.2 | Up to 512GB M.2 |
| Mechanical | |
|---|---|
| Dimensions | 56mm x 108mm x 153mm2.2″ x 4.25″ x 6.02″ |
| Weight | 0.96 kg2.12 lbs |
| Environment | |
|---|---|
| Operating Temp. | -25-70℃ |
| Storage Temp. | -40-85℃ |
| Humidity | 10%~90%, non-condensing |
| Shock | MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II |
| Vibration | MIL-STD-810G, Method 514.6, Category 4 |
| System | |
|---|---|
| CPU | 12/13th Gen. Intel® Core™ i9/i7/i5 |
| Chipset | Q670E |
| Graphics | UHD Graphics 770 |
| Memory | 64GB DDR5 |
| Lifecycle (Availability) | Target 2035 |
| I/O | |
|---|---|
| Ethernet | Additional 4x GigE ports by 4x Intel® I210 controllers, supporting 9.5 kB jumbo frame via MezIO-G4Additional 4x PoE+ ports by 4x Intel® I210 controllers, supporting 9.5 kB jumbo frame via MezIO-G4P |
| USB | Additional 4x USB 3.1 ports via MezIO-U4-50 |
| Serial | Additional 4x RS-232/422/485 + 4x RS-232 ports via MezIO-C180-50Additional 4x RS-232/422/485 + 4x RS-422/485 ports via MezIO-C181-50 |
| Video | 1x VGA1x DVI-D1x DisplayPort |
| Audio | 1x Mic-In1x Speaker-Out |
| Isolated Digital I/O | 16-CH isolated DI + 16-CH isolated DO via MezIO-D230-508-CH isolated DI + 8-CH isolated DO via MezIO-D220-50 |
| Expansion | |
|---|---|
| Mini-PCIe | 1x Mini-PCIe |
| M.2 | 1x M.2 |
| Storage | |
|---|---|
| M.2 | Up to 512GB NVME |
| SATA | Up to 2TB SSD |
| mSATA | Up to 512GB SATA |
| Mechanical | |
|---|---|
| Dimensions | 240mm x 225mm x 79mm9.45″ x 8.86″ x 3.11″ |
| Weight | kg lbs |
| Environment | |
|---|---|
| Operating Temp. | -25-70℃ |
| Storage Temp. | -40-85℃ |
| Humidity | 10%~90%, non-condensing |
| Shock | MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II |
| Vibration | MIL-STD-810G, Method 514.6, Category 4 |
| Certifications | |
|---|---|
| Safety | UL |
| System | |
|---|---|
| CPU | 12/13th Gen. Intel® Core™ i9/i7/i5 |
| Chipset | H610E |
| Graphics | UHD Graphics 770/730 |
| Memory | 8GB |
| I/O | |
|---|---|
| Ethernet | 2x 2.5GbE |
| USB | 4x USB 3.2 Gen 1x1 (5 Gbps)2x USB 2.0 |
| Serial | 3x RS-2321x RS-232/422/485 |
| Video | 1x VGA1x DisplayPort |
| Audio | 1x 3.5mm jack for Mic-In and Speaker-Out |
| Expansion | |
|---|---|
| Mini-PCIe | 2x Mini-PCIe |
| M.2 | 1x M.2 |
| Storage | |
|---|---|
| M.2 | Up to 512GB NVME |
| SATA | Up to 2TB SSD |
| Mechanical | |
|---|---|
| Dimensions | 212mm x 165mm x 80mm8.35″ x 6.5″ x 3.15″ |
| Weight | 2.5 kg5.51 lbs |
| Environment | |
|---|---|
| Operating Temp. | -10-60℃ |
| Storage Temp. | -40-85℃ |
| Humidity | 10%~90%, non-condensing |
| Shock | MIL-STD-810H, Method 516.8, Procedure I |
| Vibration | MIL-STD-810H, Method 514.8, Category 4 |
| System | |
|---|---|
| CPU | 12/13th Gen. Intel® Core™ i9/i7/i5 |
| Chipset | Q670E |
| Graphics | UHD Graphics 770 |
| Memory | 64GB DDR5 |
| Lifecycle (Availability) | Target 2035 |
| I/O | |
|---|---|
| Ethernet | Additional 4x GigE ports by 4x Intel® I210 controllers, supporting 9.5 kB jumbo frame via MezIO-G4Additional 4x PoE+ ports by 4x Intel® I210 controllers, supporting 9.5 kB jumbo frame via MezIO-G4P |
| USB | Additional 4x USB 3.1 ports via MezIO-U4-50 |
| Serial | Additional 4x RS-232/422/485 + 4x RS-232 ports via MezIO-C180-50Additional 4x RS-232/422/485 + 4x RS-422/485 ports via MezIO-C181-50 |
| Video | 1x VGA1x DVI-D1x DisplayPort |
| Audio | 1x Mic-In1x Speaker-Out |
| Isolated Digital I/O | 16-CH isolated DI + 16-CH isolated DO via MezIO-D230-508-CH isolated DI + 8-CH isolated DO via MezIO-D220-50 |
| Expansion | |
|---|---|
| Mini-PCIe | 1x Mini-PCIe |
| M.2 | 1x M.2 |
| Storage | |
|---|---|
| M.2 | Up to 512GB NVME |
| SATA | Up to 2TB SSD |
| mSATA | Up to 512GB SATA |
| Mechanical | |
|---|---|
| Dimensions | 240mm x 225mm x 79mm9.45″ x 8.86″ x 3.11″ |
| Weight | kg lbs |
| Environment | |
|---|---|
| Operating Temp. | -25-70℃ |
| Storage Temp. | -40-85℃ |
| Humidity | 10%~90%, non-condensing |
| Shock | MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II |
| Vibration | MIL-STD-810G, Method 514.6, Category 4 |
| Certifications | |
|---|---|
| Safety | UL |
| System | |
|---|---|
| CPU | 12/13th Gen. Intel® Core™ i9/i7/i5 |
| Chipset | Q670E |
| Graphics | UHD Graphics 770 |
| Memory | 64GB DDR5 |
| Lifecycle (Availability) | Target 2035 |
| I/O | |
|---|---|
| Ethernet | Additional 4x GigE ports by 4x Intel® I210 controllers, supporting 9.5 kB jumbo frame via MezIO-G4Additional 4x PoE+ ports by 4x Intel® I210 controllers, supporting 9.5 kB jumbo frame via MezIO-G4P |
| USB | Additional 4x USB 3.1 ports via MezIO-U4-50 |
| Serial | Additional 4x RS-232/422/485 + 4x RS-232 ports via MezIO-C180-50Additional 4x RS-232/422/485 + 4x RS-422/485 ports via MezIO-C181-50 |
| Video | 1x VGA1x DVI-D1x DisplayPort |
| Audio | 1x 3.5mm jack for Mic-In and Speaker-Out |
| Isolated Digital I/O | 16-CH isolated DI + 16-CH isolated DO via MezIO-D230-508-CH isolated DI + 8-CH isolated DO via MezIO-D220-50 |
| Expansion | |
|---|---|
| PCIe | 1x PCIe x16 |
| Mini-PCIe | 1x Mini-PCIe |
| M.2 | 1x M.2 |
| Storage | |
|---|---|
| M.2 | Up to 512GB NVME |
| SATA | Up to 2TB SSD |
| Mechanical | |
|---|---|
| Dimensions | 240mm x 225mm x 90mm9.45″ x 8.86″ x 3.54″ |
| Weight | 4.4 kg9.7 lbs |
| Environment | |
|---|---|
| Operating Temp. | -25-70℃ |
| Storage Temp. | -40-85℃ |
| Humidity | 10%~90%, non-condensing |
| Shock | MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II |
| Vibration | MIL-STD-810G, Method 514.6, Category 4 |
| Certifications | |
|---|---|
| Safety | UL |

