| System | |
|---|---|
| CPU | 12/13th Gen. Intel® Core™ i9/i7/i5 |
| Chipset | Q670E |
| Graphics | UHD Graphics 770 |
| Memory | 64GB DDR5 |
| Lifecycle (Availability) | Target 2035 |
| I/O | |
|---|---|
| Ethernet | Additional 4x GigE ports by 4x Intel® I210 controllers, supporting 9.5 kB jumbo frame via MezIO-G4Additional 4x PoE+ ports by 4x Intel® I210 controllers, supporting 9.5 kB jumbo frame via MezIO-G4P |
| USB | Additional 4x USB 3.1 ports via MezIO-U4-50 |
| Serial | Additional 4x RS-232/422/485 + 4x RS-232 ports via MezIO-C180-50Additional 4x RS-232/422/485 + 4x RS-422/485 ports via MezIO-C181-50 |
| Video | 1x VGA1x DVI-D1x DisplayPort |
| Audio | 1x 3.5mm jack for Mic-In and Speaker-Out |
| Isolated Digital I/O | 16-CH isolated DI + 16-CH isolated DO via MezIO-D230-508-CH isolated DI + 8-CH isolated DO via MezIO-D220-50 |
| Expansion | |
|---|---|
| PCIe | 1x PCIe x16 |
| Mini-PCIe | 1x Mini-PCIe |
| M.2 | 1x M.2 |
| Storage | |
|---|---|
| M.2 | Up to 512GB NVME |
| SATA | Up to 2TB SSD |
| Mechanical | |
|---|---|
| Dimensions | 240mm x 225mm x 90mm9.45″ x 8.86″ x 3.54″ |
| Weight | 4.4 kg9.7 lbs |
| Environment | |
|---|---|
| Operating Temp. | -25-70℃ |
| Storage Temp. | -40-85℃ |
| Humidity | 10%~90%, non-condensing |
| Shock | MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II |
| Vibration | MIL-STD-810G, Method 514.6, Category 4 |
| Certifications | |
|---|---|
| Safety | UL |
| System | |
|---|---|
| CPU | 12/13th Gen. Intel® Core™ i9/i7/i5 |
| Chipset | Q670E |
| Graphics | UHD Graphics 770 |
| Memory | 64GB DDR5 |
| Lifecycle (Availability) | Target 2035 |
| I/O | |
|---|---|
| Ethernet | Additional 4x GigE ports by 4x Intel® I210 controllers, supporting 9.5 kB jumbo frame via MezIO-G4Additional 4x PoE+ ports by 4x Intel® I210 controllers, supporting 9.5 kB jumbo frame via MezIO-G4P |
| USB | Additional 4x USB 3.1 ports via MezIO-U4-50 |
| Serial | Additional 4x RS-232/422/485 + 4x RS-232 ports via MezIO-C180-50Additional 4x RS-232/422/485 + 4x RS-422/485 ports via MezIO-C181-50 |
| Video | 1x VGA1x DVI-D1x DisplayPort |
| Audio | 1x 3.5mm jack for Mic-In and Speaker-Out |
| Isolated Digital I/O | 16-CH isolated DI + 16-CH isolated DO via MezIO-D230-508-CH isolated DI + 8-CH isolated DO via MezIO-D220-50 |
| Expansion | |
|---|---|
| PCIe | 2x PCIe x16 |
| Mini-PCIe | 1x Mini-PCIe |
| M.2 | 1x M.2 |
| Storage | |
|---|---|
| M.2 | Up to 512GB NVME |
| SATA | Up to 2TB SSD |
| Mechanical | |
|---|---|
| Dimensions | 240mm x 225mm x 110.5mm9.45″ x 8.86″ x 4.35″ |
| Weight | kg lbs |
| Environment | |
|---|---|
| Operating Temp. | -25-70℃ |
| Storage Temp. | -40-85℃ |
| Humidity | 10%~90%, non-condensing |
| Shock | MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II |
| Vibration | MIL-STD-810G, Method 514.6, Category 4 |
| Certifications | |
|---|---|
| Safety | UL |
| System | |
|---|---|
| CPU | 12/13th Gen. Intel® Core™ i9/i7/i5 |
| Chipset | Q670E |
| Graphics | UHD Graphics 770 |
| Memory | 64GB DDR5 |
| Lifecycle (Availability) | Target 2035 |
| I/O | |
|---|---|
| Ethernet | Additional 4x GigE ports by 4x Intel® I210 controllers, supporting 9.5 kB jumbo frame via MezIO-G4Additional 4x PoE+ ports by 4x Intel® I210 controllers, supporting 9.5 kB jumbo frame via MezIO-G4P |
| USB | Additional 4x USB 3.1 ports via MezIO-U4-50 |
| Serial | Additional 4x RS-232/422/485 + 4x RS-232 ports via MezIO-C180-50Additional 4x RS-232/422/485 + 4x RS-422/485 ports via MezIO-C181-50 |
| Video | 1x VGA1x DVI-D1x DisplayPort |
| Audio | 1x 3.5mm jack for Mic-In and Speaker-Out |
| Isolated Digital I/O | 16-CH isolated DI + 16-CH isolated DO via MezIO-D230-508-CH isolated DI + 8-CH isolated DO via MezIO-D220-50 |
| Expansion | |
|---|---|
| PCIe | 2x PCIe x16 |
| Mini-PCIe | 1x Mini-PCIe |
| M.2 | 1x M.2 |
| Storage | |
|---|---|
| M.2 | Up to 512GB NVME |
| SATA | Up to 2TB SSD |
| Mechanical | |
|---|---|
| Dimensions | 240mm x 225mm x 110.5mm9.45″ x 8.86″ x 4.35″ |
| Weight | kg lbs |
| Environment | |
|---|---|
| Operating Temp. | -25-70℃ |
| Storage Temp. | -40-85℃ |
| Humidity | 10%~90%, non-condensing |
| Shock | MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II |
| Vibration | MIL-STD-810G, Method 514.6, Category 4 |
| Certifications | |
|---|---|
| Safety | UL |
| System | |
|---|---|
| CPU | 12/13th Gen. Intel® Core™ i9/i7/i5 |
| Chipset | Q670E |
| Graphics | UHD Graphics 770 |
| Memory | 64GB DDR5 |
| Lifecycle (Availability) | Target 2035 |
| I/O | |
|---|---|
| Ethernet | Additional 4x GigE ports by 4x Intel® I210 controllers, supporting 9.5 kB jumbo frame via MezIO-G4Additional 4x PoE+ ports by 4x Intel® I210 controllers, supporting 9.5 kB jumbo frame via MezIO-G4P |
| USB | Additional 4x USB 3.1 ports via MezIO-U4-50 |
| Serial | Additional 4x RS-232/422/485 + 4x RS-232 ports via MezIO-C180-50Additional 4x RS-232/422/485 + 4x RS-422/485 ports via MezIO-C181-50 |
| Video | 1x VGA1x DVI-D1x DisplayPort |
| Audio | 1x 3.5mm jack for Mic-In and Speaker-Out |
| Isolated Digital I/O | 16-CH isolated DI + 16-CH isolated DO via MezIO-D230-508-CH isolated DI + 8-CH isolated DO via MezIO-D220-50 |
| Expansion | |
|---|---|
| Mini-PCIe | 1x Mini-PCIe |
| M.2 | 1x M.2 |
| Storage | |
|---|---|
| M.2 | Up to 512GB NVME |
| SATA | Up to 2TB SSD |
| mSATA | Up to 512GB SATA |
| Mechanical | |
|---|---|
| Dimensions | 240mm x 225mm x 79mm9.45″ x 8.86″ x 3.11″ |
| Weight | kg lbs |
| Environment | |
|---|---|
| Operating Temp. | -25-70℃ |
| Storage Temp. | -40-85℃ |
| Humidity | 10%~90%, non-condensing |
| Shock | MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II |
| Vibration | MIL-STD-810G, Method 514.6, Category 4 |
| Certifications | |
|---|---|
| Safety | UL |
| System | |
|---|---|
| CPU | 12/13th Gen. Intel® Core™ i9/i7/i5 |
| Chipset | Q670E |
| Graphics | UHD Graphics 770 |
| Memory | 64GB DDR5 |
| Lifecycle (Availability) | Target 2035 |
| I/O | |
|---|---|
| Ethernet | Additional 4x GigE ports by 4x Intel® I210 controllers, supporting 9.5 kB jumbo frame via MezIO-G4Additional 4x PoE+ ports by 4x Intel® I210 controllers, supporting 9.5 kB jumbo frame via MezIO-G4P |
| USB | Additional 4x USB 3.1 ports via MezIO-U4-50 |
| Serial | Additional 4x RS-232/422/485 + 4x RS-232 ports via MezIO-C180-50Additional 4x RS-232/422/485 + 4x RS-422/485 ports via MezIO-C181-50 |
| Video | 1x VGA1x DVI-D1x DisplayPort |
| Audio | 1x 3.5mm jack for Mic-In and Speaker-Out |
| Isolated Digital I/O | 16-CH isolated DI + 16-CH isolated DO via MezIO-D230-508-CH isolated DI + 8-CH isolated DO via MezIO-D220-50 |
| Expansion | |
|---|---|
| PCIe | 1x PCIe x16 |
| Mini-PCIe | 1x Mini-PCIe |
| M.2 | 1x M.2 |
| Storage | |
|---|---|
| M.2 | Up to 512GB NVME |
| SATA | Up to 2TB SSD |
| Mechanical | |
|---|---|
| Dimensions | 240mm x 225mm x 90mm9.45″ x 8.86″ x 3.54″ |
| Weight | 4.4 kg9.7 lbs |
| Environment | |
|---|---|
| Operating Temp. | -25-70℃ |
| Storage Temp. | -40-85℃ |
| Humidity | 10%~90%, non-condensing |
| Shock | MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II |
| Vibration | MIL-STD-810G, Method 514.6, Category 4 |
| Certifications | |
|---|---|
| Safety | UL |
| System | |
|---|---|
| CPU | 12/13th Gen. Intel® Core™ i9/i7/i5 |
| Chipset | Q670E |
| Graphics | UHD Graphics 770 |
| Memory | 64GB DDR5 |
| Lifecycle (Availability) | Target 2035 |
| I/O | |
|---|---|
| Ethernet | Additional 4x GigE ports by 4x Intel® I210 controllers, supporting 9.5 kB jumbo frame via MezIO-G4Additional 4x PoE+ ports by 4x Intel® I210 controllers, supporting 9.5 kB jumbo frame via MezIO-G4P |
| USB | Additional 4x USB 3.1 ports via MezIO-U4-50 |
| Serial | Additional 4x RS-232/422/485 + 4x RS-232 ports via MezIO-C180-50Additional 4x RS-232/422/485 + 4x RS-422/485 ports via MezIO-C181-50 |
| Video | 1x VGA1x DVI-D1x DisplayPort |
| Audio | 1x 3.5mm jack for Mic-In and Speaker-Out |
| Isolated Digital I/O | 16-CH isolated DI + 16-CH isolated DO via MezIO-D230-508-CH isolated DI + 8-CH isolated DO via MezIO-D220-50 |
| Expansion | |
|---|---|
| PCIe | 2x PCIe x16 |
| Mini-PCIe | 1x Mini-PCIe |
| M.2 | 1x M.2 |
| Storage | |
|---|---|
| M.2 | Up to 512GB NVME |
| SATA | Up to 2TB SSD |
| Mechanical | |
|---|---|
| Dimensions | 240mm x 225mm x 110.5mm9.45″ x 8.86″ x 4.35″ |
| Weight | kg lbs |
| Environment | |
|---|---|
| Operating Temp. | -25-70℃ |
| Storage Temp. | -40-85℃ |
| Humidity | 10%~90%, non-condensing |
| Shock | MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II |
| Vibration | MIL-STD-810G, Method 514.6, Category 4 |
| Certifications | |
|---|---|
| Safety | UL |
| System | |
|---|---|
| CPU | 8/9th Gen. Intel® Core™ i7/i5 |
| Chipset | H310 |
| Graphics | UHD Graphics 630 |
| Memory | 8GB |
| Lifecycle (Availability) | Target 2030 |
| I/O | |
|---|---|
| Ethernet | 2x GbE |
| USB | 4x USB 3.2 Gen 1x1 (5 Gbps) |
| Serial | 3x RS-2321x RS-232/4851x RS-232/422/485 |
| Video | 2x DVI-D |
| Audio | 1x 3.5mm jack for Mic-In and Speaker-Out |
| Expansion | |
|---|---|
| PCIe | 1x PCIe x161x PCIe x4 |
| PCI | 1x PCI |
| Mini-PCIe | 1x Mini-PCIe |
| Storage | |
|---|---|
| SATA | Up to 2TB SSD |
| mSATA | Up to 512GB SATA |
| Mechanical | |
|---|---|
| Dimensions | 174mm x 330mm x 174mm6.85″ x 12.99″ x 6.85″ |
| Weight | 4.5 kg9.92 lbs |
| Environment | |
|---|---|
| Operating Temp. | -25-60℃ |
| Storage Temp. | -40-85℃ |
| Humidity | 10%~90%, non-condensing |
| Shock | MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II |
| Vibration | MIL-STD-810G, Method 514.6, Category 4 |
| System | |
|---|---|
| CPU | 12/13th Gen. Intel® Core™ i9/i7/i5 |
| Chipset | H610E |
| Graphics | UHD Graphics 770/730 |
| Memory | 8GB |
| Lifecycle (Availability) | Target 2035 |
| I/O | |
|---|---|
| Ethernet | 4x 2.5GbE |
| USB | 4x USB 3.2 Gen 1x1 (5 Gbps)2x USB 2.0 |
| Serial | 3x RS-2321x RS-232/422/485 |
| DIO | 4-CH DIO |
| Video | 1x VGA1x DisplayPort |
| Audio | 1x 3.5mm jack for Mic-In and Speaker-Out |
| Expansion | |
|---|---|
| Mini-PCIe | 2x Mini-PCIe |
| M.2 | 1x M.2 |
| Storage | |
|---|---|
| M.2 | Up to 512GB M.2 |
| SATA | Up to 2TB SSD |
| Mechanical | |
|---|---|
| Dimensions | 212mm x 165mm x 63mm8.35″ x 6.5″ x 2.48″ |
| Weight | 2.5 kg5.51 lbs |
| Environment | |
|---|---|
| Operating Temp. | -25-60℃ |
| Storage Temp. | -40-85℃ |
| Humidity | 10%~90%, non-condensing |
| Shock | MIL-STD-810H, Method 516.8, Procedure I |
| Vibration | MIL-STD-810H, Method 514.8, Category 4 |
| System | |
|---|---|
| CPU | Intel Atom E3950 |
| Chipset | SoC |
| Graphics | HD Graphics 505 |
| Memory | 8GB DDR3L |
| Lifecycle (Availability) | Target 2028 |
| I/O | |
|---|---|
| Ethernet | 1x GbE2x PoE |
| USB | Additional 4x USB 3.1 ports via MezIO-U4-30 |
| Serial | Additional 4x RS-232/422/485 + 4x RS-232 ports via MezIO-C180-50Additional 4x RS-232/422/485 + 4x RS-422/485 ports via MezIO-C181-50 |
| Video | 1x DVI-I |
| Audio | 1x Mic-In1x Speaker-Out |
| Isolated Digital I/O | 16-CH isolated DI + 16-CH isolated DO via MezIO-D230-508-CH isolated DI + 8-CH isolated DO via MezIO-D220-50 |
| Expansion | |
|---|---|
| Mini-PCIe | 1x Mini-PCIe |
| Storage | |
|---|---|
| mSATA | Up to 512GB SATA |
| Mechanical | |
|---|---|
| Dimensions | 56mm x 108mm x 153mm2.2″ x 4.25″ x 6.02″ |
| Weight | 0.9 kg1.98 lbs |
| Environment | |
|---|---|
| Operating Temp. | -25-70℃ |
| Storage Temp. | -40-85℃ |
| Humidity | 10%~90%, non-condensing |
| Shock | 50 Grms, Half-sine 11 ms |
| Vibration | 5 Grms, 5-500 Hz, 3 Axes |
| System | |
|---|---|
| CPU | Intel Atom E3950 |
| Chipset | SoC |
| Graphics | HD Graphics 505 |
| Memory | 8GB DDR3L |
| Lifecycle (Availability) | Target 2028 |
| I/O | |
|---|---|
| Ethernet | 3x GbE |
| USB | Additional 4x USB 3.1 ports via MezIO-U4-30 |
| Serial | Additional 4x RS-232/422/485 + 4x RS-232 ports via MezIO-C180-50Additional 4x RS-232/422/485 + 4x RS-422/485 ports via MezIO-C181-50 |
| Video | 1x DVI-I |
| Audio | 1x Mic-In1x Speaker-Out |
| Isolated Digital I/O | 16-CH isolated DI + 16-CH isolated DO via MezIO-D230-508-CH isolated DI + 8-CH isolated DO via MezIO-D220-50 |
| Expansion | |
|---|---|
| Mini-PCIe | 1x Mini-PCIe |
| Storage | |
|---|---|
| mSATA | Up to 512GB SATA |
| Mechanical | |
|---|---|
| Dimensions | 56mm x 108mm x 153mm2.2″ x 4.25″ x 6.02″ |
| Weight | 0.9 kg1.98 lbs |
| Environment | |
|---|---|
| Operating Temp. | -25-70℃ |
| Storage Temp. | -40-85℃ |
| Humidity | 10%~90%, non-condensing |
| Shock | 50 Grms, Half-sine 11 ms |
| Vibration | 5 Grms, 5-500 Hz, 3 Axes |

