| System | |
|---|---|
| CPU | Intel Pentium N4200 |
| Chipset | SoC |
| Graphics | HD Graphics 505 |
| Memory | 8GB DDR3L |
| Lifecycle (Availability) | Target 2028 |
| I/O | |
|---|---|
| Ethernet | 1x GbE2x PoE |
| USB | Additional 4x USB 3.1 ports via MezIO-U4-30 |
| Serial | Additional 4x RS-232/422/485 + 4x RS-232 ports via MezIO-C180-50Additional 4x RS-232/422/485 + 4x RS-422/485 ports via MezIO-C181-50 |
| Video | 1x DVI-I |
| Audio | 1x Mic-In1x Speaker-Out |
| Isolated Digital I/O | 16-CH isolated DI + 16-CH isolated DO via MezIO-D230-508-CH isolated DI + 8-CH isolated DO via MezIO-D220-50 |
| Expansion | |
|---|---|
| Mini-PCIe | 1x Mini-PCIe |
| Storage | |
|---|---|
| mSATA | Up to 512GB SATA |
| Mechanical | |
|---|---|
| Dimensions | 56mm x 108mm x 153mm2.2″ x 4.25″ x 6.02″ |
| Weight | 0.9 kg1.98 lbs |
| Environment | |
|---|---|
| Operating Temp. | -25-70℃ |
| Storage Temp. | -40-85℃ |
| Humidity | 10%~90%, non-condensing |
| Shock | 50 Grms, Half-sine 11 ms |
| Vibration | 5 Grms, 5-500 Hz, 3 Axes |
| System | |
|---|---|
| CPU | Intel Pentium N4200 |
| Chipset | SoC |
| Graphics | HD Graphics 505 |
| Memory | 8GB DDR3L |
| Lifecycle (Availability) | Target 2028 |
| I/O | |
|---|---|
| Ethernet | 3x GbE |
| USB | Additional 4x USB 3.1 ports via MezIO-U4-30 |
| Serial | Additional 4x RS-232/422/485 + 4x RS-232 ports via MezIO-C180-50Additional 4x RS-232/422/485 + 4x RS-422/485 ports via MezIO-C181-50 |
| Video | 1x DVI-I |
| Audio | 1x Mic-In1x Speaker-Out |
| Isolated Digital I/O | 16-CH isolated DI + 16-CH isolated DO via MezIO-D230-508-CH isolated DI + 8-CH isolated DO via MezIO-D220-50 |
| Expansion | |
|---|---|
| Mini-PCIe | 1x Mini-PCIe |
| Storage | |
|---|---|
| mSATA | Up to 512GB SATA |
| Mechanical | |
|---|---|
| Dimensions | 56mm x 108mm x 153mm2.2″ x 4.25″ x 6.02″ |
| Weight | 0.9 kg1.98 lbs |
| Environment | |
|---|---|
| Operating Temp. | -25-70℃ |
| Storage Temp. | -40-85℃ |
| Humidity | 10%~90%, non-condensing |
| Shock | 50 Grms, Half-sine 11 ms |
| Vibration | 5 Grms, 5-500 Hz, 3 Axes |
| System | |
|---|---|
| CPU | Intel Atom E3950 |
| Chipset | SoC |
| Graphics | HD Graphics 505 |
| Memory | 8GB DDR3L |
| Lifecycle (Availability) | Target 2028 |
| I/O | |
|---|---|
| Ethernet | 1x GbE2x PoE |
| USB | Additional 4x USB 3.1 ports via MezIO-U4-30 |
| Serial | Additional 4x RS-232/422/485 + 4x RS-232 ports via MezIO-C180-50Additional 4x RS-232/422/485 + 4x RS-422/485 ports via MezIO-C181-50 |
| DIO | 4-CH DIO |
| Video | 1x DVI-I |
| Audio | 1x Mic-In1x Speaker-Out |
| Isolated Digital I/O | 16-CH isolated DI + 16-CH isolated DO via MezIO-D230-508-CH isolated DI + 8-CH isolated DO via MezIO-D220-50 |
| Expansion | |
|---|---|
| Mini-PCIe | 1x Mini-PCIe |
| Storage | |
|---|---|
| mSATA | Up to 512GB SATA |
| Mechanical | |
|---|---|
| Dimensions | 153mm x 108mm x 56mm6.02″ x 4.25″ x 2.2″ |
| Weight | 1 kg2.2 lbs |
| Environment | |
|---|---|
| Operating Temp. | -25-70℃ |
| Storage Temp. | -40-85℃ |
| Humidity | 10%~90%, non-condensing |
| Shock | 50 Grms, Half-sine 11 ms |
| Vibration | 5 Grms, 5-500 Hz, 3 Axes |
| System | |
|---|---|
| CPU | Intel Atom x6211E |
| Chipset | SoC |
| Graphics | UHD Graphics |
| Memory | 8GB |
| I/O | |
|---|---|
| Ethernet | 2x GbE |
| USB | 2x USB 3.1 Gen 1 (5 Gbps)2x USB 2.0 |
| Serial | 3x RS-2321x RS-232/422/485 |
| Video | 1x DisplayPort |
| Expansion | |
|---|---|
| M.2 | 2x M.2 |
| Storage | |
|---|---|
| M.2 | Up to 512GB NVME |
| mSATA | Up to 512GB SATA |
| Mechanical | |
|---|---|
| Dimensions | 52mm x 89mm x 112mm2.05″ x 3.5″ x 4.41″ |
| Weight | 0.6 kg1.32 lbs |
| Environment | |
|---|---|
| Operating Temp. | -25-70℃ |
| Storage Temp. | -40-85℃ |
| Humidity | 10%~90%, non-condensing |
| Shock | MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II |
| Vibration | MIL-STD-810G, Method 514.6, Category 4 |
| System | |
|---|---|
| CPU | Intel Atom x6211E |
| Chipset | SoC |
| Graphics | UHD Graphics |
| Memory | 8GB |
| I/O | |
|---|---|
| Ethernet | 2x GbE |
| USB | 2x USB 3.1 Gen 1 (5 Gbps)2x USB 2.0 |
| Serial | 3x RS-2321x RS-232/422/485 |
| DIO | 4-CH DIO |
| Video | 1x DisplayPort |
| Expansion | |
|---|---|
| M.2 | 2x M.2 |
| Storage | |
|---|---|
| M.2 | Up to 512GB M.2 |
| Mechanical | |
|---|---|
| Dimensions | 52mm x 89mm x 112mm2.05″ x 3.5″ x 4.41″ |
| Weight | 0.6 kg1.32 lbs |
| Environment | |
|---|---|
| Operating Temp. | -25-70℃ |
| Storage Temp. | -40-85℃ |
| Humidity | 10%~90%, non-condensing |
| Shock | MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II |
| Vibration | MIL-STD-810G, Method 514.6, Category 4 |
| System | |
|---|---|
| CPU | Intel Atom x6211E |
| Chipset | SoC |
| Graphics | UHD Graphics |
| Memory | 8GB |
| I/O | |
|---|---|
| Ethernet | 2x GbE |
| USB | 2x USB 3.1 Gen 1 (5 Gbps)2x USB 2.0 |
| Serial | 3x RS-2321x RS-232/422/485 |
| Video | 1x DisplayPort |
| Expansion | |
|---|---|
| M.2 | 2x M.2 |
| Storage | |
|---|---|
| M.2 | Up to 512GB M.2 |
| Mechanical | |
|---|---|
| Dimensions | 52mm x 89mm x 112mm2.05″ x 3.5″ x 4.41″ |
| Weight | 0.6 kg1.32 lbs |
| Environment | |
|---|---|
| Operating Temp. | -25-70℃ |
| Storage Temp. | -40-85℃ |
| Humidity | 10%~90%, non-condensing |
| Shock | MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II |
| Vibration | MIL-STD-810G, Method 514.6, Category 4 |
| System | |
|---|---|
| CPU | 8/9th Gen. Intel® Core™ i7/i5 |
| Chipset | H310 |
| Graphics | UHD Graphics 630 |
| Memory | 8GB |
| Lifecycle (Availability) | Target 2030 |
| I/O | |
|---|---|
| Ethernet | 2x GbE |
| USB | 4x USB 3.1 Gen 1 (5 Gbps) |
| Serial | 2x RS-2322x RS-232/422/485 |
| Video | 1x VGA1x DVI-D |
| Audio | 1x 3.5mm jack for Mic-In and Speaker-Out |
| Expansion | |
|---|---|
| Mini-PCIe | 1x Mini-PCIe |
| M.2 | 1x M.2 |
| Storage | |
|---|---|
| M.2 | Up to 512GB M.2 |
| SATA | Up to 2TB SSD |
| Mechanical | |
|---|---|
| Dimensions | 255mm x 173mm x 76mm10.04″ x 6.81″ x 2.99″ |
| Weight | 2.68 kg5.91 lbs |
| Environment | |
|---|---|
| Operating Temp. | -25-60℃ |
| Storage Temp. | -40-85℃ |
| Humidity | 10%~90%, non-condensing |
| Shock | MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II |
| Vibration | MIL-STD-810G, Method 514.6, Category 4 |
| System | |
|---|---|
| CPU | 8/9th Gen. Intel® Core™ i7/i5 |
| Chipset | H310 |
| Graphics | UHD Graphics 630 |
| Memory | 8GB |
| Lifecycle (Availability) | Target 2030 |
| I/O | |
|---|---|
| Ethernet | 2x GbE |
| USB | 4x USB 3.1 Gen 1 (5 Gbps) |
| Serial | 3x RS-2321x RS-232/4851x RS-232/422/485 |
| Video | 2x DVI-D |
| Audio | 1x Mic-In1x Speaker-Out |
| Expansion | |
|---|---|
| PCIe | 1x PCIe x16 |
| PCI | 4x PCI |
| Storage | |
|---|---|
| SATA | Up to 2TB SSD |
| mSATA | Up to 512GB SATA |
| Mechanical | |
|---|---|
| Dimensions | 185mm x 235mm x 174mm7.28″ x 9.25″ x 6.85″ |
| Weight | 3.6 kg7.94 lbs |
| Environment | |
|---|---|
| Operating Temp. | -25-60℃ |
| Storage Temp. | -40-85℃ |
| Humidity | 10%~90%, non-condensing |
| Shock | MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II |
| Vibration | MIL-STD-810G, Method 514.6, Category 4 |
| System | |
|---|---|
| CPU | 8/9th Gen. Intel® Core™ i7/i5 |
| Chipset | C246 |
| Graphics | UHD Graphics 630 |
| Memory | 8GB |
| Lifecycle (Availability) | Target 2030 |
| I/O | |
|---|---|
| Ethernet | 2x GbE |
| USB | 4x USB 3.1 Gen 2 (10 Gbps)4x USB 3.1 Gen 1 (5 Gbps) |
| Serial | 2x RS-2322x RS-232/422/485 |
| DIO | 8-CH DIO |
| Video | 1x VGA1x DVI-D1x DisplayPort |
| Audio | 1x 3.5mm jack for Mic-In and Speaker-Out |
| Expansion | |
|---|---|
| PCIe | 2x PCIe x162x PCIe x8 |
| PCI | 3x PCI |
| Mini-PCIe | 2x Mini-PCIe |
| M.2 | 1x M.2 |
| Storage | |
|---|---|
| M.2 | Up to 512GB NVME |
| SATA | Up to 2TB SSD |
| mSATA | Up to 512GB SATA |
| Mechanical | |
|---|---|
| Dimensions | 259mm x 280mm x 198mm10.2″ x 11.02″ x 7.8″ |
| Weight | 7 kg15.43 lbs |
| Environment | |
|---|---|
| Operating Temp. | -25-60℃ |
| Storage Temp. | -40-85℃ |
| Humidity | 10%~90%, non-condensing |
| Shock | MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II |
| Vibration | MIL-STD-810G, Method 514.6, Category 4 |
| System | |
|---|---|
| CPU | 8/9th Gen. Intel® Core™ i7/i5 |
| Chipset | H310 |
| Graphics | UHD Graphics 630 |
| Memory | 8GB |
| Lifecycle (Availability) | Target 2030 |
| I/O | |
|---|---|
| Ethernet | 2x GbE |
| USB | 4x USB 3.1 Gen 1 (5 Gbps) |
| Serial | 3x RS-2321x RS-232/4851x RS-232/422/485 |
| Video | 2x DVI-D |
| Audio | 1x 3.5mm jack for Mic-In and Speaker-Out |
| Expansion | |
|---|---|
| PCIe | 1x PCIe x161x PCIe x8 |
| PCI | 3x PCI |
| Mini-PCIe | 1x Mini-PCIe |
| Storage | |
|---|---|
| SATA | Up to 2TB SSD |
| mSATA | Up to 512GB SATA |
| Mechanical | |
|---|---|
| Dimensions | 185mm x 235mm x 174mm7.28″ x 9.25″ x 6.85″ |
| Weight | 3.6 kg7.94 lbs |
| Environment | |
|---|---|
| Operating Temp. | -25-60℃ |
| Storage Temp. | -40-85℃ |
| Humidity | 10%~90%, non-condensing |
| Shock | MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II |
| Vibration | MIL-STD-810G, Method 514.6, Category 4 |

